Latest Posts - Page 4
IC Packaging: An Essential Enabler and Differentiator, Part 2
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
IC Packaging: An Essential Enabler and Differentiator, Part 1
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015
Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer...
Could Virtual SoCs built using FOWLP displace Interposers in Consumer Applications?
For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only...
Rudolph Acquires Inspection Technology of Stella Alliance, LLC
Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a... Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest...
SPTS: Sigma fxP PVD with Multi-Wafer Degas
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It...
Amkor Execs Outline Strategy for the Future of Advanced Packaging
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
ECTC 2015: From the Tech Sessions Part 2
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for Success
Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference...
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
Advancing Sensing Solutions to 3D and Beyond
A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on... TechSearch International Analyzes Flip Chip and Wafer Level Package Growth
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to...
2014 Advanced Packaging and Integration Technology Symposium Spreads Message of Collaborative Innovation
Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed...
SORIN CRM: 3D IC Module for Active Medical Implant
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has... 