Latest Posts - Page 3
Community Member Monthly Highlights – April 2023
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent...
IFTLE 553: Samsung Foundry Update; Amkor/ GlobalFoundries Venture
Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained...
The Drive to Silicon Carbide: Amkor Expands Power Solutions for Automotive Electrification
TEMPE, Ariz. — March 28, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading outsourced semiconductor assembly and test (OSAT)...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
Partnership expands European and transatlantic semiconductor supply chain TEMPE, Ariz. and DRESDEN, Germany, February 16, 2023 — Amkor Technology, Inc. (Nasdaq:...
Community Member Preview: Chiplet Summit
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Community Member Monthly Highlights – December
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
SEMICON Europa 2022 Member Preview
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
Amkor Leverages Its Global Automotive Leadership to Support European Semiconductor Ecosystem
TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
ECTC 2022: Amazing In-person Packaging Community Participation!
The 72nd IEEE Electronic Components and Technology Conference (ECTC) was held again in person from May 31st to June 3rd,...
What’s Happening at the IMAPS SiP Conference?
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
ECTC 2022 Member Preview — Stacked and Packed
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
Is Vehicle Electrification Driving Evolution of the Supply Chain?
If CES® 2022 was any indication, the automotive industry is yet again in the crosshairs of both consumers and industry...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
IFTLE 513: The IPC NA Advanced Packaging Ecosystem Gap Assessment
The IPC is a non-profit global association for printed circuit board (PCB) manufacturers. Traditionally its focus has been on printed...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
IFTLE 510: DNP Glass Interposer; Samsung/Amkor team for H-Cube
JISSO JOINT consortium In late 2019 Showa Denko bought Hitachi Chemical (HC) for about $8.9B. HC had an operating income...
