Latest Posts - Page 2
April Member News: Earth Day, Partnerships, Notable Achievements
As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
January Member Achievements, New Hires and Grand Openings
Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here...
Amkor Technology Submits Net Zero Goal to Science Based Targets Initiative (SBTi)
TEMPE, Ariz. – Dec. 12, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, announced...
IFTLE 577: Amkor Announces US Packaging Facility; IBAS RESHAPE Winners Announced
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the...
Amkor Announces US Advanced Packaging and Test Facility
Amkor enables a resilient domestic semiconductor supply chain with the construction of its new advanced packaging facility in Arizona TEMPE,...
Member Monthly Highlights – November
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
Community Member Monthly News – October
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
Amkor’s Newest Factory Opens in Vietnam
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has scheduled the grand opening of its newest...
Community Member Monthly News – September
Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
CHIPCon 2023: Demystifying the Chiplet Ecosystem
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
SEMICON West 2023 Member Preview
SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries...
3D InCites Community Member Monthly Highlights — June
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should...
Amkor Advanced Packaging Enables the Car of the Future
TEMPE, Ariz.–Jun. 13, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the...
