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Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN / GRAZ, Austria, November 13, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Silicon Austria Labs (SAL), Austria’s leading...
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation Hubs. Aside from the CHIPS Acts $52B in subsidies for American chipmakers and 25% tax credits for capital expenditures, the Department of Commerce is also allocating $10B (over five years)...
Samsung Foundry SAINT-S Samsung Foundry revealed their SAINT-S technology for SRAM on logic 3DIC, at the recent IMAPS Device Packaging Conference, and it is certainly worthy of a closer look. As shown in Figure 1, it is an SRAM on Logic 3DIC with 4µm TSV on 50µm pitch. It consists of...
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified a gap and set out to fill it. This time, the gap fell in between research and development (R&D) and the ramp to manufacturing for customer products built using heterogeneous...
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud...
ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment....
It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads: “2.5D and 3D IC assembly is a hot market.” Why else would the wire-bond giant invest in developing a thermocompression chip-to-substrate (C2S) bonder for high-volume 2.5D and 3D IC die...
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a follow up purchase order for the latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM (Integrated Device Manufacturer). The customer, who installed SUSS MicroTec tools in 2012, plans...
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ. Technologists from SEMATECH’s 3D Interconnect program have demonstrated a novel die-to-wafer...
Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has shipped an EVG520IS semi-automated wafer bonding...
