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Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of the winners who attended the the gala event at IMAPS Symposium 2024. They are, from left to right: Brandon Hamilton, BAE Systems; Casey Kraweic, StratEdge; Gary Hemphill, Retired; Phil Garrou,...
Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so energizing to reconnect face-to-face with those industry colleagues who were able to make the trip. While the keynotes and sessions provided great insight on technology trends impacting the microelectronics industry,...
Melville, NY (July 7, 2021) – Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications announced the expansion of its Hybrid and assembly business with the acquisition of assets of the microelectronics business from Ultra CEMS (“Ultra”),...
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference name implies its focus to be the International Electronic DEVICES Meeting, I was glad to see that IEDM looked again way beyond devices into application-specific topics and system-level challenges of...
Why DID you miss your 2014 3D Stacked DRAM equipment shipment forecast? And what’s different about the outlook for 3D Stacked DRAM equipment shipments in 2015? Briefly, as presented in Part 1 of this thread, significant structural problems existed in the DRAM industry, present from the very beginning of 2012, that...
Some technologies take forever to cross the chasm into successful commercialization. Or they never do, and end up together with Wile E. Coyote at the bottom of the canyon. My take today is that heterogeneous integration is showing signs of a successful chasm leap. Heterogeneous integration is going to be the...
Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference flows for both 3D IC stacks and 16nm FinFETS (everyone else puts the 16nm FinFETS first, but I’m most excited about the 3D IC news.) According to Peter Clarke in...
At last week’s SEMATECH technology round-up webcast, Sitaram Arkalgud, director of 3D interconnect, made a comment about 3D technologies that, in my opinion, really brought all the issues swirling around it to one vital point. It was this: as a platform, 3D allows a whole other scheme of processes to...
As the old saying goes, things usually happen in threes… and in this case 3D. Three years ago, EV Group (EVG) teamed up with Brewer Science, Inc. (BSI) to develop temporary wafer bonding and debonding processes using EVG tools and BSI's materials. Just a few weeks ago, CEA Léti...
2024 3D InCites Technology Enablement Awards Finalists For the 2024 3D InCites Awards, we decided to change things up a bit and do away with our standard categories from previous years. Instead, we will be awarding five Technology Enablement Awards to companies who have identified a challenge in the adoption...
