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BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our...
BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High-Speed Die Bonder, MRSI-HVM3, to support our photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and we are shipping to...
As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated to the full spectrum of 3DIC and packaging, fan-out technologies and MEMS/sensors. We enjoyed 12% attendee growth over 2016, welcoming nearly 600 attendees from 20...
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind three. But as always, EV Group didn’t disappoint for my visit Friday (January 17, 2014) to see the company’s latest additions, both to the physical plant and to the product...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in...
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies. Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s...
Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology for backside illumination imaging sensors. “We believe that Ziptronix’s patented oxide bonding technology, called ZiBond™, enables the industry’s lowest distortion for imaging systems utilizing backside illumination” said Dan Donabedian, CEO...
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf, who, as part of his management and coordination of Fraunhofer IZM-ASSID (All System Silicon Integration Dresden) is the program & project manager for 3D Wafer Level System Integration (WLSI) and...
A walk across the impressive Bernin, France campus that is home to two of Soitec Group’s three divisions takes you past three production-level fab facilities – aptly named Bernin 1, Bernin 2, and Bernin 3, plus a development facility. The company’s three-stage business model encompasses innovation, licensing, and production...
