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MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high-force die bonder, a new variant of the proven MRSI-705 platform. The MRSI-705HF is equipped with a heated bond head that can apply up...
FREMONT, Calif. – Mar 15, 2021 – YES (Yield Engineering Systems, Inc.), a preferred provider of material modification and surface enhancement solutions for the semiconductor, life science and display markets, today announced that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding. The new...
As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as many chips and sensors in the smallest space. For this reason, the thickness reduction of semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile....
MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Die bonding demonstrations will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 12-15, 2019. MRSI will demonstrate the industry-leading 1.5 micrometer die...
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. In this article, we will unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery. After DTCO...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on...
Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since...
Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple I approach to success. Triple I stands for Invent, Innovate, Implement, and refers to EVG’s mission of getting into whatever market they target at the ground level, investing 20% of...
There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this year are plentiful and varied. There’s something for everyone: 3D metrology, 3D interconnect and standards development; 3D IC co-design, 3D bonding and thin wafer handling, 3D test solutions, commercialization of...
