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TSMC Advanced Packaging in US Scheduled for 2028; Focusing on SoIC/CoPoS From Taiwan we hear that TSMC has accelerated Fab construction in Arizona. The third wafer fab in the United States will use N2 (2nm) and A16 process technology. It has been reported that equipment manufacturers were notified of this...
Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1). For the same die size and thickness, WBG devices provide higher breakdown voltage, current, operating temperature, and switching speed; and lower switching loss over Si devices. ST Microelectronics (ST Micro) started working...
The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more than Moore (MtM) industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity,...
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry-leading throughput, superior flexibility, and future-proven 3μm placement accuracy. The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing...
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. UnitySC One of the big stories...
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016....
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue...
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing temporary bond systems. This Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well...
SUSS MicroTec and Thin Material cooperate on a temporary bonding process that simplifies the debond process by eliminating a number of steps thus saving time and lowering device costs.
EV Group (EVG) and Applied Materials, Inc. announced a joint effort to develop wafer bonding processes for the manufacture of TSVs for 3D IC packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D...
