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ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center. “We are pleased to receive these...
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference Center, with an anticipated record number in attendance. The microelectronics assembly & advanced packaging event will bring together industry engineers, researchers and top experts participating in a multi-faceted technical program...
Economics are forcing semiconductor manufacturers away from traditional 3D through silicon via (TSV) packaging integration. The future of advanced packaging continues to evolve towards chiplets and innovative new ways to combine specialized microelectronics components. This allows manufacturers to streamline the production for individual “subassemblies” that can then be configured later...
As semiconductor device manufacturers further shrink the size and increase the reliability of packaging devices, plasma treatment is increasingly used for advanced applications during wafer level packaging. For advanced applications Trymax has released a new low temperature plasma treatment for packaging solutions. This new DCP™, Direct Coupling Plasma Technology, for...
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging and related technology innovations to meet market demand. Unlike in previous years, when she had to spend part of her MEPTEC presentation explaining what the term “advanced packaging” means and...
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned...
Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate the “turbulent plane ride” of ramping thermo-compression bonding die attach to volume production just might go down in history as the most talked (and laughed) about incident at the 2016...
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report Status and Prospects for the Advanced Packaging Industry. And right now, more than 100 companies are involved in assembly and packaging activities in China. Almost all key global integrated device manufacturers...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond...
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a resurgence in 3D wafer level packaging (3D WLP); the first-generation 3D that started with CMOS image sensors in the middle of the last decade. This year’s growth was predominantly due...
