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Shield USA Project will strengthen U.S. semiconductor packaging capabilities The National Institute of Standards and Technology — part of the U.S. Department of Commerce — announced today that it plans to award as much as $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative. SHEILD...
New Tools Drive Innovation in Semiconductor Packaging with AI Solutions that Improve Yield and Quality MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ — Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting and inspection system and the next generation of the...
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I covered was the IMAPS Device Packaging Conference in 2009. We officially launched the first website in time for SEMICON...
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy, and comfort are the keywords of today’s automotive industry. Under this dynamic context, the...
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve product quality and design efficiency through the use of new design technologies. For example, system-scaling demands change as Moore’s law becomes increasingly difficult to maintain, thus driving growth of innovative...
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”,...
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial...
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in...
In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than ever to maintain intra-wafer uniformity throughout the wafer or die stacking process flow, process control by means of metrology and inspection is more important than ever. The industry offers a...
2023 3D InCites Awards Winner Circle The 2023 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...
