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The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging, today formally introduced IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development. IMAPS has a strong track record of delivering in-person...
At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...
Yole Développement (Yole) power electronics team’s presents this year an optimistic analysis of the power electronics industry. The power device market is showing a comfortable 13.9% growth between 2018, compared to 2017. The market research & strategy consulting company points out a second consecutive high-growth year in this industry, after...
Malicious Embedded Chips in our Mother Boards? Early October brought a report from Bloomberg that I have heard was the top tech story circulating at the DoD and DARPA. For years, articles about counterfeit chips, and our reliance on Asian-made chips – where they could be modified in ways to pass...
MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch in mid-March 2018, I was pleased to see that it was none other than Rich Rice, VP Business Development,...
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what exactly is FOWLP? Why do we need it? How do we take advantage of it? What limitations still need to be overcome?...
Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a greater number of I/O contacts, at a lower cost. With FOWLP today we have the ability to embed heterogeneous devices including baseband processors, RF transceivers, and power management ICs in...
Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level Package (FOWLP) platform has been gaining momentum with the advantages it offers in electrical performance, assembly process efficiency and low geometric profile. Different approaches of Package-on-Package (PoP) stacking in FOWLP...
I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why? Because after years of waiting in the shadows for its day in the sun, advanced packaging is finally getting its turn, thanks to the push towards heterogeneous integration, which relies on advanced packaging...
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest macro defect inspection tool, the NSX®330 Series. The NSX 330 Series provides high-speed macro defect inspection and 2D and 3D metrology for advanced packaging applications, which are being developed to...
