Matches for your search: "fan-out wafer level packaging "
In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors were available for customizing gate arrays and/or logic functions in standard cell chips. And then, “megacells” (a.k.a. Functional Blocks, Semiconductor IP Blocks), comprised of 100s, even 1000s, and more transistors...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
Despite the economic downturn caused by the fight against the Covid-19 virus pandemic, there are some potential growth areas this year. Growth in advanced packaging continues for datacenter servers, AI accelerators, and the 5G infrastructure. The shelter-in-place requirements have driven out-of-season demand for game consoles, commercial and educational laptops and...
