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Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites Community has already grown to 29 members. I visited with a few of them in person at IMAPS DPC to learn more about them, get updates on their activities in...
Let’s look at a few more presentations from the SEMI 3D & Systems Summit which was held in late January in Dresden. KLA showed this interesting schematic of where inspection was necessary for high-density 2.5/3D packaging. Embedded Chip Technology AT&S gave an interesting presentation on “Heterogeneous Module Integration using Embedded...
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because IC package substrates are processed in panels. The main driver for large area FO panel development is cost reduction because more parts can be processed in a batch. TechSearch International’s...
You may have noticed a newcomer to the 3D InCites community. But Onto Innovation is not a new company. It is the result of the 2019 merging of equals of two successful process control solutions providers who wanted to expand to serve the semiconductor manufacturing supply chain from end to...
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...
We are preparing content for our 2nd annual print edition! 3D InCites is Looking for: Executive viewpoints on today’s megatrends and what’s needed to achieve them. Contributed Technology Features on topics like: Chiplet integration techniques Process improvements for panel and wafer-level fan-out Inspection technologies for heterogeneous integration (HI) Advancements in...
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving substrate layer counts to more than 20. Larger die sizes and multiple die mounted on the substrate are driving the need for larger body sizes, up to 100...
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...
Key advanced packaging technology influencers came out in force to discuss the status of EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business (Mentor) and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor,...
Submit your 2020 3D InCites Awards nomination to recognize excellence in heterogeneous integration. Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging,...
