We are preparing content for our 2nd annual print edition!
3D InCites is Looking for:
Executive viewpoints on today’s megatrends and what’s needed to achieve them.
Contributed Technology Features on topics like:
- Chiplet integration techniques
- Process improvements for panel and wafer-level fan-out
- Inspection technologies for heterogeneous integration (HI)
- Advancements in process control
- Advanced substrates for HI
- High reliability materials
- And more…
Publication date: March 2, 2020
Printed issues mailed to community Members and Leaders as a benefit of membership.
Show distribution at IMAPS DPC 2020, ECTC 2020, SEMICON West 2020, IMAPS Symposium 2020, IWLPC 2020 and more
Ad space close: Jan 10, 2020; Email us for Ad rates
Editorial contributions due: December 15, 2019
Camera ready materials due: Jan. 20, 2020
MEDIA KITS AVAILABLE ONLINE SOON!