Hot Topic: 2020 3D InCites Yearbook Editorial and Advertising Opportunities

Hot Topic: 2020 3D InCites Yearbook Editorial and Advertising Opportunities

We are preparing content for our 2nd annual print edition!

3D InCites is Looking for:

Executive viewpoints on today’s megatrends and what’s needed to achieve them.

Contributed Technology Features on topics like:

  • Chiplet integration techniques
  • Process improvements for panel and wafer-level fan-out
  • Inspection technologies for heterogeneous integration (HI)
  • Advancements in process control
  • Advanced substrates for HI
  • High reliability materials
  • And more…

*Submit abstracts asap

Publication date: March 2, 2020

Printed issues mailed to community Members and Leaders as a benefit of membership.

Show distribution at IMAPS DPC 2020, ECTC 2020, SEMICON West 2020, IMAPS Symposium 2020, IWLPC 2020 and more

Ad space close: Jan 10, 2020; Email us for Ad rates

Editorial contributions due: December 15, 2019

Camera ready materials due:  Jan. 20, 2020

MEDIA KIT NOW AVAILABLE