2020 3D InCites Awards Nomination

Submit your 2020 3D InCites Awards nomination to recognize excellence in heterogeneous integration.

Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.

Winners will be selected by a panel of five judges: four are industry experts and the fifth judge is YOU, the 3D InCites Community, via the online ballot.

2020 Judges Panel

Jan Vardaman,
Techsearch International, Inc.
Jean-Christoph Eloy,
Yole Développement
Mike Pineilis,
Microtech Ventures, Inc.
Rozalia Beica,
3D Integration Expert

Nominations are now closed!

See who has been nominated!

The voting begins on February 3 and ends February 13, 2020. Winners will be announced on Friday, February 14, 2020 and awards will be presented in a ceremony during the IMAPS Device Packaging Conference in Fountain Hills, AZ (March 2-5, 2020).

Important Dates:

  • Nominations open January 13, 2020, and closes on January 29, 2020.
  • Voting begins February 3, 2020, and closes on February 14, 2020.
  • Winners will be announced Monday, February 17. 2020 

Learn more about the awards

There is no fee for submitting a 2020 3D InCites Awards nomination, but we welcome donations in any amount, which will be donated to for STEM education.