Matches for your search: "fan-out wafer level packaging "
By Abdelhamid El-Sawy, Ph.D., Senior R&D Scientist and Bud Troche, Senior Director of Wafer Level Packaging, MacDermid Alpha Electronics Solutions Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control, and chemical...
Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec. Through the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT™). This collaboration builds on IBM’s...
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11 professional development courses Keynotes from MIT, Bosch, NXP, Reliance and ADI Panel session on mm wave packaging As always it was a great atmosphere to see old friends and make...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with a focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial,...
Will TSMC build advanced packaging facilities offshore? In IFTLE 490, we reported that TSMC is considering building an advanced IC packaging plant in the US. Now, from the Asia Times we learn in an article by Scott Foster, an analyst with Lightstream Research – Tokyo that in February, it was...
“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole). Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts,...
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies’ Philippines manufacturing facility. The investment will permit the expansion of the WLCSP capacity already in mass...
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%...
STATS ChipPAC Ltd., semiconductor test and advanced packaging service provider, today held the groundbreaking ceremony for a new factory in Singapore. The new 197,000 square foot building will be located next to the Company’s current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for...
EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and...
