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TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor Technology. Under the agreement, Amkor will provide TSMC with turnkey advanced packaging and test services from its planned assembly and test company plant in Peoria, Arizona. Both TSMC and Amkor...
Eleven customers pre-ordered 75 Dragonfly G3 systems with new EB40 modules for high-speed, all-surface wafer inspection New EB40 tool expands the Company’s process control market for advanced logic and memory wafers WILMINGTON, Mass.–(BUSINESS WIRE)–Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing and process requirements ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding...
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for low complexity ICs. Since then, Asia has proven itself as the world’s dominant wafer manufacturer and developer of process technologies, down to smallest feature sizes. On August 4, 2020, I...
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the...
As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were developed by integrated device manufacturers like IBM, DEC, NEC, Fujitsu, etc. In the early 2000s, this baton was passed to the OSATS like Amkor, ASE,...
Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues)¹ is undoubtedly a dynamic sector where innovations play a key...
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...
TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK)...
Emerging “More than Moore” and photonic applications benefit tremendously from the close integration of compound semiconductor materials. Recently, many of the improvements in device performance achieved within the semiconductor industry are a result of innovation and material research rather than traditional downscaling of design features. One of the major new...
