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To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help of the local committee and the IMAPS team – the first ever IMAPS Executive Summit. The theme was Advanced Packaging 2025: Market Momentum & Investment Outlook. According to Beica, what...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act. Amkor announced in November 2023 its plans to build its first domestic OSAT...
Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology conferences, Advanced Packaging Summit on September 5th and SEMICON Taiwan...
There is a bit of debate about the role that heterogeneous packaging plays in furthering Moore’s Law. Moore’s Law has historically focused on the number of transistors doubling per unit area. In discussions at IEDM, it appears that the definition is being modified to include the chip stacking that is...
The annual IEEE Electronics Packaging Technology Conference (EPTC 2020 – Asia’s equivalent to the ECTC) took place virtually in December, instead of in Singapore as originally planned. With most of the world’s packaging being done in Asia, it is always a great source of interesting advanced packaging presentations. Let’s take...
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than nothing. I will leave the discussion of what I would like to see improved in the software package for the organizers. Let’s first take a look at three key papers...
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by...
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device asking selling price (ASP), resulting...
2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.“And 2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole in an article posted on i-micronews.com....
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS Image Sensors (CIS) applications, the flip chip market is expanding. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and...
