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Koh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in booth 5949. The show will take place in its new venue at the Phoenix Convention Center from October 7–9,...
This is by far my favorite blog post to write each year; the one where I get to announce the winners of the 3D InCites Awards. This year we had 36 nominees for 10 2023 3D InCites Awards categories, representing companies from around the world, all working to advance the...
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some post-pandemic social contact. It was somewhat of a homecoming for me since my career started in the Boston suburbs where I worked for 12 years (1975 – 1986) at Dow...
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on...
Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. The market-leading...
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially, we identified the five key platforms that we believe will be leveraged across a multitude of applications and markets now and in the future. The selected platforms are low-cost flip chip,...
In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly...
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to increase. TechSearch International’s new study, 2015 Flip Chip and WLP: Emerging Trends and Market Forecasts, provides unparalleled analysis of what’s behind the numbers for the growth of flip chip and...
The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User Group Meetings focused around Plasma Applications, CMP, Thin Films, Junction Technology, and PV. Individually, these worthwhile User Group Meetings, graciously hosted by SEMI at SEMI HQ in San Jose, allow speakers...
