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Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India. With nearly 25,000 systems installed at...
3D InCites is excited to be the official industry partner of the 2025 IMAPS Device Packaging Conference (DPC) this March. With such a strong member presence this year, I’m looking forward to meeting so many of you during the course of the event! Taking place from March 3-6 in Phoenix...
Get ready, because the IMAPS International Symposium on Microelectronics is coming up quickly. As the event continues its very impressive run of 57 years, this year’s symposium will take place from September 30 – October 3 at the Encore Boston Harbor. With 15 3D InCites Community Members presenting and 20...
India is a rapidly growing consumer of semiconductors. Its market was $22 billion in 2019 and is expected to nearly triple to $64 billion by 2026, according to Counterpoint Technology Market Research. By 2030 they expect to account for 10% of global consumption. This past March, India announced a major...
MUNICH, May 30th, 2023 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to its advanced optical scanning methodology, Wave3000 can accurately measure wafer deformities in specific handling positions. It...
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end hybrid bonding for 3D/Heterogeneous Integration EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today introduced the EVG®320 D2W die...
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these technologies very simple descriptions. if you don’t mind. MCM MCM integrates different chips and...
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in the collaboration along the full supply and value chain from the early beginning of new projects. The package is becoming a...
“The sum is greater than the whole of its parts.” ~ Aristotle (and Bill Chen) While the technology tracks offered the latest developments in interposer and 3D IC processes, fan-out, wafer-level packaging, flip chip, MEMs, sensors and more, System-in-package (SiP) was the big story of the 2016 MAPS Device Packaging...
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt, and nothing got thrown, mind you, but it’s clear that we’ve got some very different opinions regarding one of my pet peeves – the ever-expanding and increasingly complex advanced packaging...
