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In today’s digital world, the demand for more powerful, efficient, and compact electronics is surging. With every leap in performance and shrinking chip size, the pressure is on for manufacturers to adopt cutting-edge metrology solutions that can keep pace and ensure flawless quality even as production volumes soar. Here, Ben...
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting article entitled “Advanced IC Packaging is Next Front in the Chip Wars”; certainly something we all see happening. Certainly, IFTLE agrees that advanced IC packaging is the new source of...
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels ACM Research, Inc. (ACM), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of its Ultra C bev-p panel bevel etching tool for...
SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and factory certifications MILPITAS, Calif. – March 18, 2024 – The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including...
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence (AI), servers, and data centers. As the technology matures, further growth is projected into consumer applications, memory devices including high bandwidth memory (HBM), and mobile and automotive applications that could...
Every now and then you run across a paper or presentation, and you say to yourself, “This clearly explains this or that technology…this is an important paper”. When I do that, I try to share them with you on IFTLE. In this case, I’m talking about the paper “2.3D Hybrid...
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production ST. FLORIAN, Austria, June 21, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it...
EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN, September 29, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor markets, today announced it has received an order from...
