LQDX Divests Aluminum Soldering Business – Mina™ – to Taiyo America Inc.
May 01, 2024 · By LQDX · Press Releases
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Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement
Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly...
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM...
Smoltek Updates on the Company’s Strategic Objectives
Smoltek Nanotech Holding AB (publ) (”Smoltek”) today announces an update and a clearer definition of the company’s strategic objectives, with...
Nordson Electronics Solutions Introduces New Helios® System for Dispensing Single-component Thermal Interface Materials
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste Carlsbad, CA, USA...
Infinitesima Selects PDF Solutions’ Cimetrix® Solution to Accelerate Time-to-Market for Its Metron3D Detection System
Cimetrix CIMControlFrameworkTM Software Enables First Delivery to a 300mm Factory May 5, 2022, Santa Clara, CA – PDF Solutions, Inc....
SEMI Veteran Paul Trio Takes Reins of SEMI Standards Program
MILPITAS, Calif. — May 4, 2022 — SEMI today announced the promotion of 20-year SEMI veteran Paul Trio to Director...
StratEdge High-Power Semiconductor Packages will be Featured at CS MANTECH in Monterey, California
Santee, Calif. — 4 May 2022 — StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for...
Atotech and Schweitzer Engineering Laboratories Announce Business Partnership
SEL to utilize Atotech’s Uniplate® equipment at SEL’s new PCB manufacturing facility in Idaho, USA Atotech products help SEL to...
YES (Yield Engineering Systems, Inc) Joins Forces with Korea’s H&iruja for Manufacturing and Distribution
YES has executed a manufacturing and distribution agreement with H&iruja to address Korea’s advanced packaging market opportunities. YES (Yield Engineering... Smoltek Extends Evaluation Agreement and Initiates MoU Negotiations with Global Manufacturer for Joint Development of Ultra-thin CNF-MIM Capacitors
This press release is an English version of the previously published Swedish version, which has interpretive precedence. Smoltek Nanotech Holding...
Increased U.S. Manufacturing of Microelectronics Enabled Through Mercury Systems’ Phoenix Facility Expansion
Customizable RF SiP solution redefines edge processing for radar, electronic warfare and 5G communications ANDOVER, Mass., March 22, 2022 —...
ERS electronic Announces the AC3 Fusion Thermal Chuck System
AC3 Fusion is a versatile and more sustainable solution for temperature test in wafer probing MUNICH, APRIL 22nd, 2022 –...
Increased U.S. Manufacturing of Microelectronics Enabled Through Mercury Systems’ Phoenix Facility Expansion
ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical...
ACM Research’s 18 Chamber, 300mm Ultra C VI Single-Wafer Cleaning Tool Enters Mass Production
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50%...
Mercury Systems Selected to Provide Secure Packaging for DoD SHIP program
ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical...
CyberOptics Highlights Best Practices for Detecting Particles in Semiconductor Environments at SPIE Advanced Lithography and Patterning
Minneapolis, Minnesota — April 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing...
Mercury Systems Selected to Provide Secure Packaging for DoD SHIP Program
ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical...
Nordson Electronics Solutions Offers Latest Dispensing, Conformal Coating, and Selective Soldering Technologies at SMTConnect 2022
Electronics manufacturing equipment to be demonstrated in the SmartTec stand 4-210 and in the Fraunhofer Future Packaging line, stand 5-434...
Raxium Selects ClassOne Solstice S4 Electroplating System to Develop Advanced microLED Displays for Augmented/Virtual Reality Applications
Four-chamber, single-wafer ClassOne Solstice tool to be deployed for R&D and volume manufacture of Raxium’s ultra-high-density monolithic RGB microLED displays ...
