Passing the Torch: Reflections from SEMICON Europa 2025
Nov 24, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 7
The IWLPC Fan-out PLP Smack Down
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which...
Weathering the Storm and Positioning the Semiconductor Industry for Growth
2019 has been a sobering year for the semiconductor industry. It started out with such high hopes, coming off of...
How 5G is Enabling a Connected World
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on...
Supporting the 3D Megatrend in Semiconductor Manufacturing
We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing,...
Your Electronics Industry Publications, Blogs, and Online Communities Need Your Support
Everyone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over...
What Role does the US-China Trade War Play in the Semiconductor Downturn?
The US-China trade war is top of mind for those who work in the semiconductor industry. How much of the...
Talking about Technology Megatrends at SEMICON West 2019
What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON...
A Look at imec’s Two-Step Wafer-level Mold Process
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its...
SiP Technology To Enable Technology Megatrends
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also...
Good News about Glass Substrates
Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for...
DBI® Ultra Changes the Game for Heterogeneous Integration
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve...
Fan-out Panel-level Packaging Comes to the ECTC Technology Corner
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about....
Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019
In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a...
ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview...
Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology
When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level...
Could ON Semiconductor be GlobalFoundries’ White Knight?
In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved...
Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected World
Why are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where...
Celebrating 25 Years of Advanced Packaging Innovation: Part 2
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning...
Celebrating 25 Years of Advanced Packaging Innovation: Part 1
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS...
