IMAPS DPC 2024 Makes Advanced Packaging Fun Again! Mar 26, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape Mar 11, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Announcing the Winners of the 2024 3D InCites Awards Feb 06, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Weathering the Storm and Positioning the Semiconductor Industry for GrowthNov 13, 2019 · By Francoise von Trapp · Blogs2019 has been a sobering year for the semiconductor industry. It started out with such high hopes, coming off of...
How 5G is Enabling a Connected WorldOct 14, 2019 · By Francoise von Trapp · BlogsIt’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on...
Supporting the 3D Megatrend in Semiconductor ManufacturingSep 18, 2019 · By Francoise von Trapp · BlogsWe’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing,...
Your Electronics Industry Publications, Blogs, and Online Communities Need Your SupportAug 27, 2019 · By Francoise von Trapp · BlogsEveryone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over...
What Role does the US-China Trade War Play in the Semiconductor Downturn?Jul 23, 2019 · By Francoise von Trapp · BlogsThe US-China trade war is top of mind for those who work in the semiconductor industry. How much of the...
Talking about Technology Megatrends at SEMICON West 2019Jul 23, 2019 · By Francoise von Trapp · BlogsWhat a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON...
A Look at imec’s Two-Step Wafer-level Mold ProcessJul 23, 2019 · By Francoise von Trapp · BlogsThe recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its...
SiP Technology To Enable Technology MegatrendsJul 03, 2019 · By Francoise von Trapp · BlogsTwo years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also...
Good News about Glass SubstratesJun 25, 2019 · By Francoise von Trapp · BlogsOver the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for...
DBI® Ultra Changes the Game for Heterogeneous IntegrationJun 18, 2019 · By Francoise von Trapp · BlogsI’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve...
Fan-out Panel-level Packaging Comes to the ECTC Technology CornerJun 12, 2019 · By Francoise von Trapp · BlogsOn my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about....
Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019Jun 11, 2019 · By Francoise von Trapp · BlogsIn the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a...
ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and PackagingMay 07, 2019 · By Francoise von Trapp · BlogsWhoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview...
Book Review: Advances in Embedded and Fan-out Wafer Level Packaging TechnologyMay 01, 2019 · By Francoise von Trapp · BlogsWhen asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level...
Could ON Semiconductor be GlobalFoundries’ White Knight?Apr 23, 2019 · By Francoise von Trapp · BlogsIn light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved...
Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected WorldApr 04, 2019 · By Francoise von Trapp · BlogsWhy are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where...
Celebrating 25 Years of Advanced Packaging Innovation: Part 2Mar 28, 2019 · By Francoise von Trapp · BlogsPicking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning...
Celebrating 25 Years of Advanced Packaging Innovation: Part 1Mar 19, 2019 · By Francoise von Trapp · BlogsAfter spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS...
Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging ConferenceMar 12, 2019 · By Francoise von Trapp · BlogsRemember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual...
A Race to the Finish: Announcing the Winners of the 2019 3D InCites AwardsMar 01, 2019 · By Francoise von Trapp · BlogsThe 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable...