The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
IMAPS DPC 2024 Makes Advanced Packaging Fun Again! Mar 26, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape Mar 11, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
What’s New for the 2017 European 3D SummitNov 28, 2016 · By Francoise von Trapp · 3D Event Coverage For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over...
MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless ThingsNov 17, 2016 · By Francoise von Trapp · 3D Event Coverage A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016)...
At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVsNov 15, 2016 · By Francoise von Trapp · Blogs Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as...
SEMICON Europa 2017 Moves to MunichNov 11, 2016 · By Francoise von Trapp · Blogs So here’s a funny story. At the MEMS Summit in Stuttgart in September, while chatting with Denny McGuirk President and...
IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced PackagingNov 04, 2016 · By Francoise von Trapp · 3D Event Coverage The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a...
At the 2016 S3S Conference, 3D Integration is Bringing Sexy BackOct 14, 2016 · By Francoise von Trapp · Blogs The IEEE S3S Conference (shorthand for the IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference; quite a mouthful, I know!) is an...
More Food for Thought From The 2016 European MEMS SummitSep 23, 2016 · By Francoise von Trapp · Blogs Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in...
European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?Sep 22, 2016 · By Francoise von Trapp · Blogs After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of the attendees asked me which...
MEMS and Sensors Industry Group Becomes Part of SEMISep 21, 2016 · By Francoise von Trapp · Blogs Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which took...
Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out PackageSep 08, 2016 · By Francoise von Trapp · Blogs There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP)...
Top Ten Reasons to Attend the 2016 European MEMS SummitAug 26, 2016 · By Francoise von Trapp · 3D Event Coverage Ok everybody, here it is, back by popular demand: the TOP TEN reasons (this time told in photos) why you...
The 2016 3D InCites Awards Scholarship goes to Sophie Mathis!Jul 28, 2016 · By Francoise von Trapp · Blogs Ever since we first established 3D InCites Awards program in 2013, our intention was to use the funds generated by...
SEMICON West 2016: Update from the Semiconductor SuppliersJul 22, 2016 · By Francoise von Trapp · Blogs Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with...
Making Connections at SEMICON West 2016Jul 20, 2016 · By Francoise von Trapp · Blogs If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a metamorphosis. It was...
And the Winners of the 2016 3D InCites Awards are…..Jul 13, 2016 · By Francoise von Trapp · Blogs For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies,...
3D InCites Guide to SEMICON WEST 2016Jul 03, 2016 · By Francoise von Trapp · 3D Event Coverage In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically...
Executive Viewpoint: The New Advanced Packaging LandscapeJun 30, 2016 · By Francoise von Trapp · Blogs You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had...
Supplier Updates from ECTC 2016Jun 17, 2016 · By Francoise von Trapp · Blogs In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3, 2016, I...
ECTC 2016: Is the Life after Moore’s Law?Jun 10, 2016 · By Francoise von Trapp · Blogs Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic...
Words of Advice From Successful Women in Advanced PackagingJun 07, 2016 · By Francoise von Trapp · Blogs For the second consecutive year, Beth Keser, Qualcomm, organized and moderated the CMPT Woman’s Panel and Reception as part of...