The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
IMAPS DPC 2024 Makes Advanced Packaging Fun Again! Mar 26, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape Mar 11, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Brighter Side of SEMICON West 2017Jul 27, 2017 · By Francoise von Trapp · 3D Event Coverage Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own...
Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)Jul 24, 2017 · By Francoise von Trapp · Blogs In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions...
2017 3D InCites Awards Ceremony and Reception: A RetrospectiveJul 19, 2017 · By Francoise von Trapp · 3D Event Coverage Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017...
Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)Jul 19, 2017 · By Francoise von Trapp · 3D In-Depth Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of...
Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAPJun 16, 2017 · By Francoise von Trapp · Blogs For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly...
Impressions from ECTC 2017Jun 12, 2017 · By Francoise von Trapp · 3D Event Coverage Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the...
Fifty Shades of Fan-out Discussed at ECTC 2017Jun 06, 2017 · By Francoise von Trapp · 3D Event Coverage The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology...
The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood CancerMay 10, 2017 · By Francoise von Trapp · Blogs It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the...
The Advanced Packaging Times, they are A-Changing…or Are They?Apr 05, 2017 · By Francoise von Trapp · 3D Event Coverage It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had...
Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!Mar 13, 2017 · By Francoise von Trapp · 3D Event Coverage Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging...
The FAST route to the Top of the TSV MountainMar 08, 2017 · By Francoise von Trapp · Blogs . While on a recent visit to UnitySC in Grenoble, France, I spent some time visiting with a semiconductor process...
What’s in Store For You at IMAPS DPC 2017Mar 01, 2017 · By Francoise von Trapp · 3D Event Coverage Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is...
Using 3D Integration to Get the Heat OutFeb 15, 2017 · By Francoise von Trapp Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25,...
Highlights from the 2017 European 3D SummitFeb 14, 2017 · By Francoise von Trapp · 3D Event Coverage The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging,...
The Edge of 3D: 3D SoC VLSI and Si PhotonicsFeb 08, 2017 · By Francoise von Trapp · Blogs Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways...
Welcome to a New Era of Predictive Yield Process Control for Advanced PackagingFeb 02, 2017 · By Francoise von Trapp · Blogs In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology...
2017 European 3D Summit: Making Advanced Packaging Great AgainJan 30, 2017 · By Francoise von Trapp · 3D Event Coverage Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced...
Top Ten Reasons to Attend the 2017 European 3D SummitJan 09, 2017 · By Francoise von Trapp · 3D Event Coverage It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly...
Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!Dec 20, 2016 · By Francoise von Trapp · Blogs Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate...