SEMICON West Navigates Semiconductor Industry Changes
Nov 18, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 11
HBM Supply Chain Seminar Highlights System-level Advantages
The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and...
DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life
DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work...
‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents,...
IC Packaging: An Essential Enabler and Differentiator, Part 2
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
IC Packaging: An Essential Enabler and Differentiator, Part 1
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit All
Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This...
TSMC’s Grand Alliance: A Powerful EcoSystem
On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress...
Ideas for Co-optimizing Chip-Package Design
In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC...
With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
DAC 2015 Focuses on the Automotive Market
By attracting 7011 EDA and IP developers and users, the 52 Design Automation Conference, held in the South Hall of San...
ECTC 2015: From the Tech Sessions Part 2
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for Success
Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference...
EDPS 2015 Looks At IC Innovations from the Design Perspective
On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC...
TSMC 2015 Technology Symposium Highlights Plans for the Coming Year
Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual...
SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool
From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials,...
DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2
Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so...
DATE 2015 demonstrates Europe’s commitment to Semiconductors
Full disclosure: I spent the first half of my life in Europe. I was born and raised in Austria, and...
