Francoise News - Page 30
Alchimer Signs Collaboration with CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications
Wet Nanometric Film Deposition Processes Capable of Delivering 20:1 Aspect Ratio TSVs at Low Cost of Ownership MASSY, France – July... SSEC Introduces WaferEtch and WaferStorm Platforms to its Portfolio of Single Wafer Wet Processing Solutions at SEMICON West 2013
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham,...
Late Breaking SEMICON West News: Expert TechHUBs Added to this Year’s Agenda
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help...
3D InCites Awards Public Opinion Poll Results Are In!
The public opinion poll closed for the first annual 3D InCites Awards on Wednesday July 3, with over 1350 votes...
Semi Trade Pubs Talk 3D, Just in time for SEMICON West
That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and...
Momentum Builds for the 2013 3D InCites Awards
Subscribers are practically blowing up 3D InCites as they duke it out online and race the July 3rd deadline for...
3D Buzz from ConFab, 3D Integration at IITC 2013, and more
So SPIL’s offering a turnkey model for 2.5D interposers, including fine-pitch fabrication of the interposer wafers themselves? This is certainly... 3D InCites Guide to SEMICON West 3D Events
Each year, I publish a Guide to SEMICON West 3D Events in an attempt to integrate both SEMI-sponsored events with... New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries
A*STAR Institute of Microelectronics and Leading Semiconductor Partners combine research and market expertise to address industry challenges Singapore, 24 June...
FormFactor: NanoPierce Contactor
Product Description FormFactor’s NanoPierce™ contactor is a socket solution for direct testing of TSVs and micro-bump arrays for 3D IC... Cascade Microtech: CM300 Probe System
Product Description Cascade Microtech’s 3D probing solution, comprising the CM300 probe station and Pyramid Probe® cards with RBI technology, captures... Dynaloy, LLC: CoatsClean
Product Description CoatsClean ER105 is a wet resist and residue remover that has been successfully used to remove post-Bosch and... SPTS: ReVia Endpoint System
Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes... Ziptronix: Copper DBI Technology for 3D Memory Assemblies
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies... SET North America: ONTOS7 Surface Preparation System
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric... Alchimer: eG3D Polymer
Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining... Xilinx: Virtex-7 H580T
Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps... Synopsys: Galaxy Implementation Platform
Product Description Synopsys’ Galaxy™ Implementation Platform is the industry’s leading solution for IC implementation and signoff. Now available with powerful...
