Francoise News - Page 32
ECTC 2013 Interview: SPTS’s Keith Buchanan Addresses Bow and Warp
A few weeks ago I spoke with SPTS’s David Butler, after he participated in the SEMICON Singapore 3D IC panel....
ECTC 2013 Interview: SSEC’s Laura Mauer Talks about TSV Reveal and TSV Clean
This year’s 3D InCites coverage of ECTC 2013 features a series of interviews with suppliers to the 2.5D and 3D...
Silicon Interposer for a 12X10 Gb/s Electro-optical Engine
By Terry Bowen and Richard Miller, TE Connectivity The increasing transmission speeds in network switching, data storage, and super computing... 3D IC System Verification Methodology: Solutions and Challenges
By Dusan Petranovic, Member, IEEE, and, Karen Chow, Member, IEEE, (Mentor Graphics) The three largest EDA companies are taking an... Scaling 100G Wired Applications with Heterogeneous 3D FPGAs
By: Ehab Mohsen, Xilinx To address the insatiable demand for bandwidth, the communications industry is accelerating development of Nx100G line...
A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology
Singapore 29 May, 2013– Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated,...
3D IC Business Model: A Customer Decision
After more than a year of touting the turnkey model, even TSMC is jumping on board the collaboration bandwagon for...
SEMICON Singapore 3D IC Wrap-Up: Bring down the cost and bring out the TSV alternatives
For the 8th year in a row, I did NOT attend SEMICON Singapore. But apparently this is the year I... 3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies
Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D...
3D Super Chips, 2.5D Technology Advancements, and 3D through the EDA Lens
TSMC calls them 3D Super Chips. The rest of the industry calls it 3D heterogeneous integration. Whatever way you slice...
Catching up with EV Group’s Dave Kirsch
Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV...
A Lull in 3D Activity or Stealth Mode?
An industry colleague commented to me recently that the press seems to have lost interest in 3DIC. As probably the...
ECTC 2013: 2.5D and 3D IC Technology Preview
One thing is for sure, from special sessions to the standard technology tracks, there is no shortage of 3D-focused events...
Welcome to 3D InCites New Home
As 3D InCites approaches its 4th birthday, the time has come for us to move out of InfoNeedle into our very own home. It’s been...
Rudolph Acquires Assets of Tamar Technologies
Rudolph Technologies, Inc., known for its process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries,...
Reinventing the PC; MEMS and LEDs Grow Up
The PC world is dead? Chris Hubbard, Intel’s Business PC Marketing Manager scoffs at the mere idea. “The demise of...
Improving Communication Across Supply Chains Makes the Impossible Possible
Semiconductor supply chain, ecosystem, value chain: whatever you call it, its become a hot topic of discussion, and one that...
2.5D Products and 3DIC Standards and Roadmaps Are On the Move
Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen...
