3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

Proceeds to Benefit The Frances B. Hugle Engineering Scholarship

Phoenix AZ and Austin TX – May 21, 2012 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first annual 3D InCites Awards. All proceeds of the awards program will benefit the IEEE Frances B. Hugle Engineering Scholarship, established to encourage young women to follow in Hugle’s footsteps and pursue career opportunities in engineering.

The 3D InCites Awards recognize achievements to further the commercialization of 2.5D and 3D IC technologies. This year’s awards will be presented at a ceremony during SEMICON West to companies whose innovative products have contributed the most to solving the technology challenges for through silicon via (TSV) technologies and related processes in 2.5D and 3D IC applications.

A panel of nine independent 3D IC industry experts will judge the awards program based on innovation, solution to a problem, and cost-of-ownership. 3D InCites readers will represent the 10th jury member by casting their vote online, the aggregate of which will equal the final vote.

3D InCites Awards will be presented in five categories:

  • 3D Products (Design/Process)
  • Design Tools
  • Manufacturing Equipment
  • Materials
  • Test and Reliability Tools/Equipment

Nominations are open through June 18, 2013. Program details and nomination criteria can be found at www.3dincites.com/3dincites-awards. Entries can be submitted online. The awards will be presented at the 3D InCites Awards Breakfast on Thursday, July 11, 2013 at the Impress Lounge (720 Howard St. San Francisco, CA 94103). Winners will receive a display award and the right to use the 2013 3D InCites Award identity for its own promotional purposes. Nominees and Winners will also be featured in an awards spotlight on www.3DinCites.com.

Sponsorship opportunities for the 3D Incites Awards Breakfast are available for companies who wish to promote their business at this event and support the IEEE Women in Engineering program and the Frances B. Hugle Engineering Scholarship. For more information, contact awards@3Dincites.com.

About the Frances B. Hugle Engineering Scholarship
The Frances B. Hugle Engineering Scholarship was established in 2012 by TechSearch International in partnership with IEEE Women in Engineering (IEEE WIE) to honor the memory of pioneering legend Frances B. Hugle, an American serial inventor, scientist and engineer. TechSearch and its founder, E. Jan Vardaman, seeded the scholarship with a $5,000 donation in 2012. The objective is to raise $100,000 over the next few years to fully fund the scholarship award program.
Established to encourage young women to follow in Hugle’s footsteps and pursue their interest in Engineering, the IEEE WIE Committee will administer the program, and will select one scholar annually to receive a $2,500 scholarship grant beginning as early as 2013.

About 3D InCites
3D InCites is an online content source founded in 2009 in an effort to stir up interest in 3D IC integration and 3D packaging technologies. For 3D integration to happen requires open collaboration across the supply chain. Therefore, 3D InCites strives to inform key decision makers about progress in technology development, design, standards, and infrastructure in order to realize commercial production of 2.5D and 3D technologies. 3D InCites is powered by Impress Labs, a global creative and marketing communications agency specializing in building brands for technology companies in the semiconductor, solar energy and life science industries. For more information visit www.3DinCites.com.

About TechSearch International
TechSearch International, Inc., founded in 1987, is the market research leader specializing in technology trends microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or http://www.techsearchinc.com.

3D InCites Contact:
Françoise von Trapp
francoise@3DinCites.com

TechSearch International Contact:
Becky Travelstead
becky@techsearchinc.com