techsearchogoIt’s been an exciting month since we first announced that 3D InCites and TechSearch International established the 3D InCites Awards for the dual purpose of recognizing achievements in furthering the commercialization of 2.5D and 3DIC technologies while also raising money and awareness of the Frances B. Hugle Engineering Scholarship, created to encourage young women to pursue a career in engineering.

liam_maddenToday we’re pleased and honored to announce that our guest speaker for the 3D InCites Awards Breakfast event will be Liam Madden, corporate vice president of FPGA Development and Silicon Technology at Xilinx. He has responsibility for FPGA design, Advanced Packaging (including 3-D chip stacking) and foundry technology. We all know that the Xilinx 2011 introduction of its Virtex 7 FPGA, built using TSV interposer technology, was an industry breakthrough that’s earned the company recognition as the first to introduceall programmable 3D ICs to the market. I first heard Madden speak at 3D ASIP 2012, where he shared “stackanomics” theory. I’m told he will share more of his insights and “lessons learned” on the road to 2.5D and 3D IC commercialization.

Madden joined Xilinx in 2008, bringing more than 25 years experience in design and technology leadership positions. He has contributed to a range of industry leading products, including: high performance and low power microprocessors (Alpha and StrongArm at DEC), embedded processors and IP (MIPS) and consumer devices (Xbox 360 at Microsoft). He holds a BE degree from UCD and an M.Eng. degree from Cornell University. We hope you’ll join us for this very special 3D InCites Awards Breakfast Ceremony, which will be held July 11, 2013, from 8-10am at the Impress Lounge, 720 Howard St., San Francisco, CA 94103. The event  is open to all but does require registration because seating is limited.

On the Nomination front, we currently have 15 worthy nominees in five categories: 3D Products (Design/Process); 3D Design Tools; 3D Manufacturing Equipment; 3D Materials, and 3D Test and Reliability Tools/Equipment. Additionally, Rudolph Technologies has signed on as a Silver Sponsor for the event.

We know there are more submissions out there, so we’ve extended the Nomination Deadline to Thursday, June 20, 2013, Midnight PDT. In addition to nine industry expert judges, we will incorporate a popular vote as the tenth judge. Online voting opens June 24, 2013 and closed for final tabulation on July 3, 2013. Be sure to visit and vote. You must be a registered member of 3D InCites and logged in to vote.

Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of…

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