Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies in December 2012. Copper DBI® technology offers higher throughput and better scalability when compared to copper thermo-compression bonding. This technology can be incorporated into die-to-die, die-to-wafer and wafer-to-wafer processes.
“There is a direct and robust synergy between our own 3D technology (FaStack®) and the Ziptronix technologies,” says Bob Patti, CTO of Tezzaron. “DBI, ZiBond, and FaStack make a formidable team. This agreement greatly enhances our ability to produce advanced 3D memories. It also extends our open platform and broadens the scope of 3D and 2.5D devices that we can assemble for customers.”
“We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for 3D memory,” says Dan Donabedian, CEO of Ziptronix. “With our DBI®, which contains interconnect at the bond interface, Tezzaron can provide a technologically superior product in the memory market at a lower cost and better performance compared to competitors also attempting 3D integration of advanced memory devices. Tezzaron stands alone today in its adoption of the most advanced interconnection technology and therefore will lead the industry in technology areas only imagined just a few short years ago.”
- Ziptronix Website
- Date this Product was Introduced to the market: 12/12/2012
- Category Product is Being Nominated for: 3D Products (Design/Process)
- Technical information on Copper DBI for 3D Memory Assemblies