Latest Posts
The Future of Image Sensors is Chip Stacking
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really...
Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate...
Ziptronix: Copper DBI Technology for 3D Memory Assemblies
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies... SET North America: ONTOS7 Surface Preparation System
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric...The post-fab process debate for 3D ICs: foundry or OSATS
Inquiring minds want to know: who is going step forward and claim ownership of post-fab processes for 3D IC stacking...
