3D Incites News - Page 22
Technology Showcase Finalists Revealed for European MEMS & Sensors Summit
GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today...
Solving the Design and Verification Challenges of High Density Advanced Packaging
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve...
EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging
Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio...
Three Patents Granted to Smoltek
Smoltek, a leading Swedish nanotech company in the semiconductor industry, has expanded its patent portfolio in Asia the last month....
High Productivity UBM/RDL Deposition by PVD for FOWLP Applications
Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a...
Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment
NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the...Will The Lifespan of CMOS Integrated Circuits End?
There is fierce competition for scaling foundry logic technologies. However, according to the 2015 International Roadmap for Semiconductors (ITRS), logic transistor...
SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer...
Advancements in Carbon Nanostructures for Advanced Packaging Applications
Moore’s law has guided the continuing miniaturization and performance enhancements of silicon chips for the semiconductor industry by scaling the...
Nanotech company, Smoltek, retains Boucher-Lensch Associates as its financial advisor
Smoltek has appointed Boucher-Lensch Associates LLC (BLA) as financial advisor for its $7 million financing round for the commercialization phase... KLA-Tencor Corp. Receives Intel’s Preferred Quality Supplier Award
KLA-Tencor Corp. has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their... Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia
San Jose, Calif., USA – Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, announced...
SEMI Foundation Appoints Leslie Tugman as Executive Director
SEMI Foundation, a nonprofit affiliate of SEMI established to support education and career awareness in the field of high-tech, has... Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry
MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today... BeSang Inc. announces 3D super-NAND flash memory
BeSang Inc., a pioneer in the monolithic 3-dimensional integrated circuits (3D ICs), announced today its proprietary 3D super-NAND development. “We are... Alchimer Rebrands as aveni; Enters Technology Commercialization Phase
Company secures $13.5M in funding led by a semiconductor chipmaker and ALIAD; Positioned to revolutionize the copper plating processes at... Genmark Automation Launches CODEX Stocker; Industry’s First Integrated Stocker, Sorter and Metrology System
Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity Fremont, Calif., July... SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing
San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the... 