3D Incites News - Page 23
KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for... Fifty Years of Moore’s Law Made Possible by Semiconductor Equipment and Materials Suppliers Worldwide
SAN JOSE, CA — April 14, 2015 — April 2015 marks the 50th anniversary of one of the business world’s... Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging
Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier... SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS... OmniVision Launches Family of High Performance 20+ Megapixel Image Sensors for Flagship Smartphones
OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced the OV23850 and OV21840, a...
Vive la SEMICON Europa (!)
As we move into the final quarter of the year, October marks the annual gathering of Europe’s microelectronics industry at... European 3D TSV Summit: “Smarter System Integration” Theme to Focus on Both Business and Technology
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France. After... Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate... Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing
Yavne, Israel – July 7, 2014 – Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement... SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications
One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 –... SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology
Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI...
SPTS: Blanket Silicon Etch Process for Via Reveal
The blanket silicon etch process performed on the SPTS Rapier XE achieves an etch rate >8.5µm/min, high selectivity (Si:SiO>150:1), and is... SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014... SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor... SEMICON Southeast Asia to be Launched in 2015
Regional Exposition to Rotate between Singapore and other areas in the region Recognizing the changing dynamics of the microelectronics industry... Akrion Systems Commences Joint Development Programs for 3D Integration Processes with Leading Research Organizations
Allentown, Pa., March 5, 2014 – Akrion Systems recently engaged in two new Joint Development Programs (JDPs) with leading-edge semiconductor research... Spirox to Represent Multitest Business for Taiwan and China
In a move to create a strong local presence to enhance sales and support services for its test handler and... Mobility and Internet of Things Drive Requirements for Innovative Sensors
Multitest, a division of LTX-Credence, and designer and manufacturer of final test handlers, contactors and load boards for the semiconductor... 