Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier this month, as the company intensifies its focus on 3D TSV Advanced Packaging. 

The company displayed and discussed its unique hardware and process technologies that reduce the cost of critical processes in advanced packaging. Process applications include advancements with thick photoresist (PR) stripping using megasonics and heated spray, concurrent TSV cleaning and PR stripping with megasonics assist and uniformity improvement as well as process time reduction for seed layer etching.

The processing advancements utilize our proven Velocity™ single wafer system. Velocity, available in four- and six-chamber configurations, uses stacked chambers to minimize footprint and allows independent front side and back side process control. Systems are available for various chemistry processes including dilute RCA solutions and solvents, for either single pass or reclaimed solutions.

Akrion is currently working with leading research institutions in advanced packaging: A*Star-IME, Singapore, CEA-Leti, France and IMEC in Belgium.

About Akrion Systems

Akrion Systems provides advanced surface preparation process solutions and systems, including single-wafer and batch-immersion cleaning tools for the microelectronic, photovoltaic and display industries. Akrion Systems’ customers produce a diverse range of products, including solar cells, integrated circuits for DRAM, Flash, Logic and MEMS as well as new and reclaimed semiconductor wafers, flat panel displays, and photomasks. The company’s headquarters in Allentown, Pennsylvania includes a class-1 clean room for process development and an ISO 9001:2000 compliant production facility. For more information contact Joseph McManus, Vice President, Sales and Marketing, 1-610-530-3471, jmcmanus@akrionsystems.com