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hybrid bonding

The Age of Hybrid Bonding: Where We Are and Where We’re Going

For decades, Moore’s Law has been a way to measure performance gains in the semiconductor industry, but the ability to double the density of transistors on a chip every two years is becoming increasingly challenging. With scaling reaching its limit, manufacturers are looking to advanced packaging innovations to extend the...

Mike Manfra, Perdue, presents keynote talk on quantum computing.

ECTC 2023: Quantum Computing, Hybrid Bonding, and the CHIPS for America Act

With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb at the 2023 Electronics Components Technology Conference (ECTC 2023), which took place May 31-June 2 in Orlando, FL. The keynote and panel sessions discussed technical topics including quantum computing, chip-to-wafer...

Hybrid Bonding takes Heterogeneous Integration to the Next Level

Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence (AI), servers, and data centers. As the technology matures, further growth is projected into consumer applications, memory devices including high bandwidth memory (HBM), and mobile and automotive applications that could...

IFTLE 529: More Hybrid Bonding from ECTC 2022

Continuing our look at key Hybrid Bonding (HB) papers at the recent ECTC 2022 in San Diego, CA. Applied Materials Hybrid bonding requires a lot of front-end processing tools, thus you can expect Applied Materials (AMAT) to be an entrant in this technology. In its paper “A Holistic Development Platform...

IFTLE 528: 72nd IEEE ECTC: A Showcase for Hybrid Bonding

The 72nd IEEE Electronic Components and Technology Conference (ECTC) took place at the end of May in San Diego CA. We all know by now that ECTC is the premier microelectronic packaging conference in the world. While I was not able to attend in person, it was NOT due to...

EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-on-a-Chip

Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and...

IFTLE 478: Chiplet Nomenclature; EV Group/ASM Support D2W Hybrid Bonding

On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and “internet of things” are buzz words that are being used way too loosely and have little meaning. I’m OK with 2.5D because I was there when it was first uttered...

ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration

Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing and process requirements ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding...

IFTLE 457: Hybrid Bonding Comes of Age

I first started covering Ziptronix and its hybrid bonding technology back in 2007 when I was writing Perspectives from the Leading Edge (PFTLE) for Semiconductor International (SI). I’d give you the references, but SI went belly up in 2010 and I learned my first lesson about the NON-archival nature of...

IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding

Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder bump technology is not expected to be able to meet those requirements, many companies have been examining Cu-to-Cu direct bonding. Cu-to-Cu bonding can be achieved through one of two ways:...