Search Results

Matches for your search: "fan-out wafer level packaging "

Fan-out wafer-level packaging research

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Mar 19, 2024

Advanced wafer-level packaging advances the next wave of innovation in global chip manufacturing TEMPE, Ariz. – March 19, 2024 – Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level...

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Aug 06, 2018

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,” written by Amy Lujan, of Savansys. Lujan did a very good analysis on the cost comparison of fan-out wafer-level packaging (FOWLP)  with chip-first and die...

Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging

Mar 27, 2017

In recent years, there has been an increased focus on fan-out wafer level packaging. While fan-out wafer level packaging may be the right solution for some designs, it is not always the lowest cost solution. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer...

A Fan-Out Wafer Level Packaging Epiphany

Sep 09, 2016

I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential nature or meaning of something.” In FvT’s piece “Spotlight on FOWLP, Monolithic 3D IC, and 3D TSVs,” (13 May 2015) I am quoted saying: “Show me where monolithic or FOWLP...

Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015

Oct 16, 2015

Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer Level Packaging Conference (IWLPC 2015), which was a bit surprising since 3D is really hitting its stride with so many products in high performance computing on the market. Next door,...