It occurred to me recently that 3D InCites would benefit from having a technical advisory board. After all, I may be the Queen of 3D when it comes to keeping track of what’s happening in this exciting and fast-paced realm of technology, but every queen needs her advisors to explain all the implications and ramifications of this information, and make sure she’s not misguiding her loyal subjects, right?
So a few weeks ago, I contacted some individuals who are recognized industry experts, and who represent the scope of the 3D market sector from across the supply chain and around the world, including 3D stacking and packaging technologies already in volume production as well as the 3D TSV markets. So far I have found four such individuals who were willing to donate their time to this effort and will actively participation in discussions and blogging.Please join me in welcoming:
Lee Smith V.P. Product Marketing, Amkor Technology, Chandler AZ
Lee is a recognized industry expert in 3-D packaging, with 30 years of diverse technology and market development experience. Lee is recognized for leading the technology and infrastructure development of the widely adopted package-on-package (PoP) technology.
Sitaram R. Arkalgud, Ph.D., Director of Interconnect SEMATECH, Albany, NY
Sitaram is Director of SEMATECH’s Interconnect Division. The current activities are focused on delivering manufacturable process technologies for 3D interconnects using through silicon vias (TSVs).
Nicolas Sillon,Ph.D. Manager, Packaging & Integration Technologies Laboratory CEA-Leti, Grenoble France
Since 2004, Nicolas has managed a lab of 50 research scientists involved in wafer level technologies for MEMS packaging, CMOS Image Sensors & 3D integration. Additionally, he has author or co-author of more than 50 papers in 3D integration & MEMS packaging area
Erik Jan Marinissen, Principal Scientist at IMEC in Leuven, Belgium
Erik Jan. focuses his research in the domain of test and debug of integrated circuits. . He serves on numerous conference committees and editorial boards, and founded such workshops as ‘Diagnostic Services in Network-on-Chips’ (DSNOC) and ‘3D Integration’.
For full bios, be sure to visit the Technical Advisory Board page. I hope to be announcing several more members of this board in the coming weeks. In the mean time, I look forward to working with this particular group of experts over the next year to
what’s happening in the world of 3D.