3D Packaging

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance applications like artificial intelligence (AI), 5G, autonomous driving, and even high-end smartphones are driving the continuation of Moore’s Law augmented by More than Moore. This need for high-performan... »

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The 2017 3D InCites Awards will be presented on Wednesday, July 12, 2017, during SEMICON West, in a ceremony at the Impress Lounge, (located above Moscone North). The ceremony will be followed immediately by a cocktail reception to benefit this year’s designate... »

ECTC 2016: Is the Life after Moore’s Law?

ECTC 2016: Is the Life after Moore’s Law?

Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic Materials, gathered a prestigious group of senior executives from the world’s leading microelectronics research institutes to discuss Life after Moore’s Law. Panelists included Marie-Noelle Semeria, CEA-Leti; Dim Lee Kwong, IME; Luc van den hove, imec; CP Wong, NCAP; and Subu Iye... »

3D Packaging Technologies for Power Electronics

3D Packaging Technologies for Power Electronics

There are a some upcoming events in the realm of power electronics that promise to be very interesting and thought provoking for those interested in 3D packaging. Some of the best and brightest minds in the area of 3D packaging (including power electronics 3D packaging technologies) will be present. 3DPEIM is focused on the three dimensional design requirements of integrated power electronics. Ot... »

European 3D Summit: Putting 3D Packaging To Work

European 3D Summit: Putting 3D Packaging To Work

Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the goals of this year’s European 3D Summit was to bring togethe... »

The European 3D Summit: From Roadmaps to Reality

The European 3D Summit: From Roadmaps to Reality

In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, and highlighted the significant growth this market space has undergone in the past year. It has also taken a new perspective, as we no longer view fan-out wafer level packaging (FOLWP) and 3D through... »

SPTS sees a Brighter 2016

SPTS sees a Brighter 2016

In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for our business. In packaging, we see a number of development projects moving into production this year, and a raft of makers adding capability to catch up with the early adopters. The major example will be the growth of fan-out wafer level packaging (FOWLP). After six years of being a niche acti... »

Heterointegration Spoor in the 2015 Analog, MEMS and Sensor Startups to Watch, Part 3

Heterointegration Spoor in the 2015 Analog, MEMS and Sensor Startups to Watch, Part 3

In Parts 1 and 2 of this series, I drew your attention to what Peter Clarke, writing in EETimes on 02 January 2015, called the “15-in-15: Analog, MEMS and sensor startups to watch in 2015.” If we were to look for heterointegration spoor amongst Peter’s 15 notable startups what would we find? The first “10-in-15” companies profiled in Parts 1 and 2, namely Cambridge CMOS Sensors; Chirp Mi... »

IWLPC Best Papers Announced

IWLPC Best Papers Announced

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry’s most respe... »

MEMS Executive Congress 2014 Gives a Nod to Heterogeneous Integration and the Three Sisters

MEMS Executive Congress 2014 Gives a Nod to Heterogeneous Integration and the Three Sisters

If you are anyone doing anything important, or wanting to know anything important about MEMS and Sensors, then you were probably at the MEMS Industry Group (MIG)’s MEMS Executive Congress US 2014, from November 5-7, in Scottsdale, AZ. (Or else you were in Phoenix for the NASCAR race, which is why I couldn’t get the Avis car I had reserved. But that’s a different story.) The MEMS Executive Co... »

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