Latest Posts - Page 2
Vive la SEMICON Europa (!)
As we move into the final quarter of the year, October marks the annual gathering of Europe’s microelectronics industry at...
Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing
Yavne, Israel – July 7, 2014 – Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement... Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology
GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach... Triton Microtechnologies Receives Funding to Ramp Glass Interposer Manufacturing for 3D and 2.5D Semiconductor Packaging
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month...
Is it Time for Fluxless Processes for 3D Packaging?
A 3D InCites reader recently inquired whether cost drivers and fine-pitch requirements in 3D applications are moving manufacturers away from...
Catching Up with Dongkai Shangguan about NCAP China
If you have an ear out for the new in the world of 3D IC technology as I do, then you... Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials...
Bumps are the Elephant in the Wafer Stress Room: NCCAVS Joint User Group Meeting On 3D Packaging
The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User...
Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK – Part 2
“The time has come when we have to understand that we can only compete WHEN we collaborate.” (Sudipto Roy, SMIC,...
SPTS Ships 1000th DRIE Process Module
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013
There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than...
