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Veeco’s Ion Beam Deposition System Chosen by Mask Blank Supplier for EUV Mask Blanks
Plainview, N.Y. — Veeco Instruments Inc. (NASDAQ: VECO) today announced that a mask blank supplier to the semiconductor industry has...
3D ICs Tear Down the Dreaded Memory Wall and Save Power
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens...
IFTLE 447: Micron and Rambus Readying HBM2 3D Stacked Memory Products
If we look back, almost a decade ago, 3D stacked memory was all the rage, and the leader in stacked...
IEDM 2019: Making Electronic Systems Smarter, Safer, and More Reliable
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference...
IFTLE 429: Samsung 12-layer memory with 3D-TSV; SHIP Winners
Samsung Electronics has announced the development of 12-layer memory using 3D through silicon via (3D-TSV) chip packaging technology. TSVs vertically...
Q2 2019: Memory Business is Approaching the Bottom
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation
The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the...
The Future of Non-volatile Memory
Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of...
The Memory Packaging Market Shows Steady Growth
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%...
The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory
Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years...
Xilinx Ultrascale+: 3D on Steroids
Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes joined the family...
Getting back to Basics: a Look at 3D NAND and 3D DRAM
There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that...
ASML at Semicon West 2013: SRAM Scaling has Stopped!
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Zvi adds information to...
Inside the Gadgets at CES 2013
One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show,...IITC Technical Conference Expands Program to include 3D Memory
A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand...