A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand the conference’s technical program with a session on alternative back-end memory technologies. The conference is specifically seeking new paper submissions on phase-change memories (PCM), resistive RAM (RRAM), conductive bridge RAM (CB-RAM), magnetoresistive RAM(MRAM) and 3D stacked NAND flash memories. The deadline for submission of abstracts is Feb. 1, 2010, but a limited number of late-news papers will be accepted until March 26, 2010.

Scheduled for June 7-9 at the Hyatt Regency San Francisco Airport Hotel in Burlingame, IITC will be preceded by a day-long Short Course on leading-edge interconnect technologies on Sunday, June 6. The conference attracts professionals in semiconductor processing, interconnect design, academia and equipment development.

“The industry is actively pursuing research on monolithically stacked 3D memory approaches today. These approaches have multiple layers of back-end compatible memory cells and interconnects stacked on top of each other. IITC, which is a forum for interconnects and back-end integration, is looking to address this topic.” said Michael Armacost, IITC 2010 Publicity Chair and Managing Director at Applied Materials, Inc. “The conference is looking for papers that highlight back-end compatible memory devices like PCM, RRAM, CB-RAM and MRAM. In addition, papers describing back-end compatible select devices, 3D crosspoint memories and 3D NAND flash memories are sought for this new session.”

Papers from universities, national laboratories, semiconductor manufacturers, foundries, and equipment/materials suppliers are encouraged. Following a rigorous review, papers will be selected for either oral presentations or poster presentations during the exhibition hours. In addition, papers will be selected for a special poster session for new engineers and students.

IITC’s traditional U.S. venue in Burlingame is now one of three international locations for this important technology conference, which rotates among them annually. In 2009, IITC was held in Sapporo, Japan, while the 2011 conference will take place in Europe.

The IITC 2010 Call for Papers and paper-submission requirements can be found on the conference website. For additional information and inquiries, interested persons may contact Wendy Walker at Widerkehr & Associates.

Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of…

View Francoise's posts

Become a Member

Media Kit