memory

SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation

SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation

The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the IC value creation is moving from the die to the IC package. Now advanced packaging technologies and materials enable combining multiple dies with heterogeneous functions as well as high-quality passives into one package. This integration increases performance, while significantl... »

Concept for 3-dimensional stacking of Flash devices. A thin film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide. A.J. Walker et al., VLSI Symposium, 2003.

The Future of Non-volatile Memory

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Flash devices. A thin-film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide. A.J. Walker et al., VLSI Symposium, 2003. The relentless shrinking of NAND Flash from ... »

The Memory Packaging Market Shows Steady Growth

The Memory Packaging Market Shows Steady Growth

The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device asking selling price (ASP), resulting in big memory integrated device manufacturers (IDMs) reaping record profit... »

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years of progress. Here we look at the dual-gate thin film transistor (DG-TFT), an extremely versatile solid-state data storage device that can be used in monolithic 3D as either a flash memory or a dynamic memory element. It has the potential to provide a path not only ... »

Xilinx Ultrascale+: 3D on Steroids

Xilinx Ultrascale+: 3D on Steroids

Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes joined the family of 3D integration technology possibilities, we’ve been careful to define them separately on 3D InCites. Some people have wondered if one will displace the other, or if these technologies would delay the adoption of 3D stacked ICs using TSVs. I maintain that these technologies h... »

Getting back to Basics: a Look at 3D NAND and 3D DRAM

Getting back to Basics: a Look at 3D NAND and 3D DRAM

There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that it was commercializing its 3D VNAND technology. There’s also been some discussion (mixed with concern) about how, if at all, 3D NAND might affect the commercialization of TSV-based 3D DRAM technologies, such as Wide I/O 2, High Bandwidth Memory (HBM) the current front-runner, Micron... »

ASML at Semicon West 2013: SRAM Scaling has Stopped!

ASML at Semicon West 2013: SRAM Scaling has Stopped!

We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Zvi adds information to his previous blog post: Dimension Scaling and the SRAM Bit-Cell. I just downloaded the ASML presentation from Semicon West2013 site – ASML’s NXE Platform Performance and Volume Introduction. Slide #5 – IC manufacture’s road maps – says it all. Embedded SRAM will ... »

Image Courtesy of brightsideofnews.com

Inside the Gadgets at CES 2013

One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show, I’ve always just followed what other editors reported. But this year after flipping around the video of Qualcomm’s Paul Jacobs’ keynote address, I kind of felt like I missed out on something. One thing is for sure, while Jacob’s assumed a certain level of tech savvyness from the audi... »