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EV Group Expands Collaboration with ITRI on Heterogeneous Integration Process Development
ST. FLORIAN, Austria, August 30, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
EV Group Lithography Solutions for Heterogeneous Integration and Wafer-level Packaging to Be Highlighted at ECTC 2022
Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More...
CyberOptics Highlights Best Practices for Detecting Particles in Semiconductor Environments at SPIE Advanced Lithography and Patterning
Minneapolis, Minnesota — April 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing...
EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom...
New Multi-Functional Micro- and Nanoimprint Solution from EV Group Offers Unprecedented Flexibility for High-Volume Optical Device Manufacturing
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
EV Group Brings High-speed High-precision Metrology to 3D Heterogeneous Integration
EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of wafer- and die-level hybrid bonding and maskless lithography FLORIAN, Austria,...
EV Group Launches First-of-its-Kind Step-and-Repeat Mastering Services for Nanoimprint Lithography
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as...
EV Group Unlocks Agile and Efficient Production Scaling with Next-Generation Step-and-Repeat Nanoimprint Lithography System
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced...
Veeco Announces Leading Semiconductor Company Orders Lithography Systems
Veeco Instruments Inc. (NASDAQ: VECO) announced that a world leader in semiconductor assembly and testing has placed a multi-system order...
EV Group Brings Maskless Lithography to High-volume Manufacturing with LITHOSCALE
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications...
Onto Innovation Announces Multiple Orders for JetStep® Panel Lithography System
Three customers select JetStep lithography to interconnect high-performance computing chips within system-in-package products Wilmington, Mass., August 3, 2020 – Onto...
EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo...
Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019
Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes...Megatrends are Changing the Future of the Lithography Equipment Market
The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding...
Volumes Matter and Other Conversations from SEMICON West 2018
The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things...
EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging
Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio...
Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program
Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of...
Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package
There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP)... 