HBM

3D ICs Eliminate the Memory Wall

3D ICs Eliminate the Memory Wall

The adoption of 3D ICs allowed the elimination of the “Memory Wall” using a new memory architecture and through silicon via (TSV) technology. While individual ICs became faster with each process node, the communication between the chips was constrained by limited pin counts, power hungry I/Os, and PCB-space limitations. Assembly of multiple dies into one package enables extremely wide busses b... »

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards

In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the year, AMD was pleased to announce its forthcoming graphics processor unit (GPU) architecture, Vega. Presented at CES 2017 and commercially available mid-2017, AMD’s GPU has been meticulously analyzed by System Plus Consulting’s lab. And the answers are very i... »

Start Your 2.5D HBM Design Today

Start Your 2.5D HBM Design Today

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. In June 2015, AMD introduced its Fiji processor, the first HBM 2.5D design, which comprises ... »

HBM Supply Chain Seminar Highlights System-level Advantages

HBM Supply Chain Seminar Highlights System-level Advantages

The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and Electronic Systems have made in the most recent 50+ years. What I like even more is the fact that an increasing number of high-tech companies and industry organizations are utilizing this great facility for charting our future path on the innovation curve with exhibitions, seminars, wo... »

The HBM Supply Chain is Open for Business!

The HBM Supply Chain is Open for Business!

Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the first time put high bandwidth memory (HBM) — a true 3D stack integrating memory die with through silicon via (TSVs) — into production. Fiji is a Si interposer-based module comprising an ASIC GPU surrounded by 4 HBM stacks, and it is powering AMD’s latest generation of Radeo... »

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But I am not here to give you investment advice. So let’s move on to a subject I am more familiar w... »

At AMD, Die Stacking Hits the Big Time

At AMD, Die Stacking Hits the Big Time

It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the Fiji GPU processor, the first to feature die stacking and high bandwidth (HBM) technology, amidst quite a bit of media fanfare at the E3 gaming conference in Los Angeles and in Beijing on June 16, 2015. This is big, news for the 3D integration community.... »

IEDM 2014 3D Short Course Highlights 3D Memory Cubes for SYSTEM design

IEDM 2014 3D Short Course Highlights 3D Memory Cubes for SYSTEM design

Years ago, when I gave my first 3D technology presentations, I noticed very different reactions from my diverse audience: The packaging engineers were in their element, engaged right away and asked detailed technical questions. The IC designers appeared quite worried about the strange — and for them, at that time — very different new challenges. The system designers followed very attentively e... »

Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in many previous years, I attended both the Sunday tutorial and the main conference on Monday and Tuesday. As usual, there were great keynotes and lots of interesting technology news. The tutorial always focuses on an important technology or market trend. This year was no e... »

Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside

Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside

Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week, a significant piece of news slipped right by usually alert 3D radar for TWO WHOLE DAYS! On Tuesday, Micron issued a press release announcing a collaboration with Intel to deliver an on-package 3D memory solution for Intel’s next-generation Xeon Phi™ processor, codenamed R... »

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