Latest Posts
May Member News: Committed to Long-Term Impact
May 2025 marked another active month for the semiconductor industry, showcasing innovation, global engagement, and strategic progress across multiple fronts....
April Member News: A More Connected and Sustainable Future
April 2025 marked a dynamic month for the semiconductor industry, with major developments across technology, sustainability, and global collaboration. Companies...
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
May Member News: Strategic Moves, Product Launches, Sustainability and more
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product...
ERS electronic Releases Fully Automatic Luminex Machines with PhotoThermal Debonding and Wafer Cleaning
ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
April Member News: Earth Day, Partnerships, Notable Achievements
As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while...
ERS electronic Announces Agreement with Geringer Halbleitertechnik GmbH & Co. KG to Strengthen R&D and Production Capabilities
MUNICH, April 9th, 2024 – ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing has finalized an...
ERS electronic Introduces The First Semi-automatic Machine from its Luminex Product Line
MUNICH, March 13th, 2024 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing is presenting the...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
SEMICON China 2024 Community Member Preview
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to...
February Member Highlights – Acquisitions, Awards, Events, New Offerings and More
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product...
ERS electronic Announces Appointment of Debbie-Claire Sanchez as Vice President
MUNICH, February 6th, 2024 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing,...
Announcing the Winners of the 2024 3D InCites Awards
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to...
SEMICON Europa 3D InCites Member Spotlight: What We’re Doing to Shape a Sustainable $1 Trillion Era
This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in...
ERS electronic Introduces “High Power Dissipation” Thermal Chuck System, Which Can Dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND Wafer Test
MUNICH, Nov. 14, 2023 /PRNewswire/ — ERS electronic, the industry leader in the market of thermal management solutions for semiconductor...
SEMICON Europa 2023 Community Member Preview
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing...
