DBI

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions in advanced IC packages to better meet cus... »

Hybrid Bonding: From Concept to Commercialization

Hybrid Bonding: From Concept to Commercialization

Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stacking with or without through silicon vias (TSVs), as well as MEMS and III-V applications. In this exclusive interview with Gill Fountain, Xperi, winner of the 2018 3D InCites Engineer of the Year award f... »

Xperi Sets Out to Enable Immersive Experiences

Xperi Sets Out to Enable Immersive Experiences

Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced packaging sector of the semiconductor industry as an IP-based technology company focused on chip packaging and interconnects that historically licensed its technology know-how and patents. In 2003, the company formed a new parent company –... »

SMIC Signs License Agreement For Invensas’ DBI Technology

SMIC Signs License Agreement For Invensas’ DBI Technology

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufa... »

Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding

Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding

The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This technology has several challenges which have limited widespread adoption in high-volume production. While the implementation of the technology at 40μm pitch is already challenging, the likelihood of extending this technology to 10μm pitch is slim,... »

Fraunhofer EMFT Signs Agreement to Implement ZiBond and DBI Technologies in MEMS Applications

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a new license agreement to incorporate ZiBond® and Direct Bond Interconnect (DBI®) technologies into their portfolio of foundry services. This agreement expands Fraunhofer EMFT’s world-class MEMS manufacturing capabilities with the most advanced 3D integr... »

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct Bond Interconnect (DBI®) technologies. With this license Sandia will have access to the most advanced 3D integration technologies available, for use in a wide range of semiconductor applications. For... »

3D Stacking is Part of Life

3D Stacking is Part of Life

Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud responded to my catcalls from the audience with, “I’m mo... »

With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge

With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge

Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas, in 2011, which focused first on what they called “bridge technologies” that leverage existing packaging technologies to meet higher density requirements while waiting for full implementation of 3D ICs. In parallel, the Invensas team worked to optimize interposer and ... »

Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!

Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!

Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE 3DIC in Sendai, Japan) that along with their manufacturing subsidiary, Novati Technologies, they have successfully manufactured the world’s first eight-layer 3D IC wafer stack containing active logic. (Figure 1). According to Tezzaron, the logic-on-log... »

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