Latest Posts - Page 4
SEMICON Europa Member Preview
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry...
Amkor Technology Announces Plans to Expand Advanced Packaging Technology Capacity with New Factory in Bac Ninh, Vietnam
Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it plans to...
IMAPS International Symposium 2021 – It’s Great to be Back!
Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so...
Panel Level Packaging Consortium 2.0 Gains Ground
Sometimes, in the face of adversity, great things can be accomplished. In this case, the adversity was the COVID-19 crisis,...
IMAPS 2021 Community Member Preview
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
IFTLE 495: Siemens – Chiplets are the New Generation of SiP
The virtual IMAPS SiP conference recently took place under the Chairmanship of Mark Gerber of ASE. Siemens EDA Keith Felton...
Amkor’s DSMBGA Advanced SiP Platform is the Preferred Packaging for 5G RF
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of...
Will An Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?
Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid...
The Electronics Supply Chain: Is it Broken?
It’s been quite a time for the entire electronics supply chain. Here’s what we know. This current strain on chips...
DPC 2021 Online Event Stacked with Community Members Leading Speaker Sessions
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
Drum Roll Please! The Winners of the 2021 3D InCites Awards are…
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments...
2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance...
The Importance of Product Burn-In Test
Introduction Product burn-in (BI) is an indispensable step in the production test flow to ensure good quality and a properly...
3D InCites Mural Project To Seed New DEI Fund
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in...
Increasing the Conductive Density of Power Packaging
March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such...
Amkor Factory Intelligence Enables Industry 4.0
TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth...
Meeting the Challenges of 5G RF Production Test Services
Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there...
IFTLE 470: More on TSMC’s SoIC Hybrid Bonding and Intel’s Woes
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop...
