Latest Posts - Page 16
SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related... Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest... TechSearch International Analyzes CSP Market Growth: QFNs Remain “Work Horse” of the Industry
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast...
The IoT at SEMICON West 2015: We Just Can’t Get Enough
As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
SEMICON West 2014: Are 3D ICs Getting the Squeeze?
With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm...
Advanced Packaging Alphabet Soup Creates Chaos for IMAPS 3D Panel
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt,... SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers
Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and...
Catching Up with Dongkai Shangguan about NCAP China
If you have an ear out for the new in the world of 3D IC technology as I do, then you...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...
